Laser Based dicing Tool
The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinafter referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.
LASER BASED DICING TOOL
UNLIMITED
BE242
BEL
Technische en beroepsbekwaamheid Technische en beroepsbekwaamheid
Financiele draagkracht Financial capablity
ESTIMATED POTENTIAL
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Secure and Responsive Portal
Our portal uses the latest information technologies and is fully secure. It is also adapted to all screen resolutions, whether you use a computer, tablet or mobile phone. In addition, our portal offers complete management of the commercial monitoring of public tenders, a view of the competition and a detailed analysis of the results.
